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September 16-18, 2024
Vienna, Austria
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Note: The schedule is subject to change.

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Tuesday September 17, 2024 16:00 - 16:40 CEST
Semiconductor industry has entered a new era of chip design, moving from monolithic SOCs to multi-chiplet design. The new generation devices demands for more functionality, higher bandwidth and lower power often within smaller footprints. Multi-chiplet packages provide improved performance, cost savings and design flexibility.
Systems that comprises more than one chip can have several SOCs that are connected externally or a SOC package comprising several SOCs connected inside a single physical package.Each SOC is integrated with an interrupt controller. In a complex SOC design where wide range of peripherals are integrated, reducing interrupt latency and complexity of handling interrupts play a major role.

This talk will cover why we need multiple interrupt controllers in a multi-chiplet design. And how to implement the interrupt routing to CPUs across different chips. Also will see how to achieve consistency between interrupt controllers in multi-chiplet system. At the end will have a look on software implementation of multichip interrupt handling refering to ARM trusted firmware by taking an example of ARM’s Generic Interrupt Controller which support multiple GIC configuration
Speakers
avatar for Priyadarsini G

Priyadarsini G

Associate Staff Engineer, Samsung Semiconductor India Research, Bangalore
Priyadarsini is an accomplished Embedded Software Engineer with over 4 years of experience in embedded systems domain. With a passion for technology and a flair for innovation, she has consistently delivered exceptional solutions in the domain of embedded systems. She is well-versed... Read More →
Tuesday September 17, 2024 16:00 - 16:40 CEST
Room 0.14 (Level 0)

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